是由新型酐單體及新型胺單體的新配方制成的聚酰氨酸樹脂，經雙向拉伸工藝生產的新型亞胺薄膜，它不僅具有普通聚酰亞胺薄膜的所有優(yōu)異性能，且具有更高的尺寸穩(wěn)定性，高彈性模量及低熱膨脹系數(shù)。
一、技術要求：
6052E Low Expansion Coefficient Polyimide Film
With the application of Bi-axial stretching Technology, this brand polyimide film, the low thermal expansion coefficient polyimide film, is made from polyamic acid resins, which is obtained from a novel formula comprised of new anhydride monomers as well as a mine monomers. It not only processes good performance of ordinary polyimide film but also has better dimension stability, higher modulus of elasticity and lower heat expansion coefficient.
1. Technical Requirement
1.1 Thickness and Width
| Thickness | 12.5 | 25.0 |
| Tolerance | +1/-1 | +1/-2 |
| Width | ≤520 | ≤520 |
| Notes: Thickness is supplied as the requests of customer |
1.2 Performace Index
| | | | |
| | |
| | | | | |
| | | | | |
| | | CD / MD | | ≥4.0 |
| 4 | Heat expansion coefficient
CD/MD 200℃, 2h | % | ≤0.1 |
| 5 | Electrical operating
frequency intensity | Average | MV/m | ≥200 |
| 6 | Heat expansion coefficient 25-200℃ | ppm / ℃ | 15-25 |
| | | | |
| | | | |
| | Relative dielectric constant 48-62Hz | | |
| | Dielectric loss factor 48-62Hz | | |
2. Application
6052E low expansion coefficient polyimide film processes higher dimension stability. Its CTE is very near copper foil which is ideal material for FPC as copper board cover.
